Abstract
In this paper, heights of bumps on the flip chip substrate in semiconductor package are inspected by using 3D inspection equipment. As a 3D inspection equipment, white light scanning interferometry with large FOV (Field Of View) is used. Experimental 3D data repeatability test results for the same flat bumps and round bumps of each substrate are shown. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.
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