Abstract
The present study aimed to determine the optimum levels of experimental factors that affect electroplating performance, i.e., filling via holes without defects. To this end, the Taguchi experimental design method was employed. The uniformity of plated Cu thickness was selected as the characteristic, and experimental conditions were determined using an orthogonal matrix array with respect to the selected experimental factors. The results were analyzed based on the signal-to-noise ratios acquired from experimental measurements. When the aspect ratio was low, the concentration of a leveler was found to be the determining factor. As the aspect ratio increased, the effect of current density and pulse time became more significant.
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