Abstract

In this study, the reaction of NF3 gas plasma with cobalt oxide (Co3O4) film grown on the Inconel base metal surface was investigated. Experimental results showed the plasma etching rate as high as 3.36 μm/min at 350 °C under 220 W of plasma power with negative 300 DC bias voltage. AES and XPS analyses revealed that reaction product is CoF2, demonstrating that the plasma processing is a fluorination reaction. Based on the linear kinetics law, the activation energy of the etching reaction was derived to be 66.93 kJ/mol. This study demonstrates that the plasma decontamination technique can be applied to efficiently and effectively remove radioactive surface contaminants such as 60Co hiding in the oxide film on the surfaces of the metallic waste generated during decommissioning of old nuclear power plants.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.