Abstract
High rate deposition of CrN x films with control of microstructure was carried out by magnetron sputtering. For these purposes, the deposition processes parameters were varied: N 2 flow rate and especially substrate bias voltage, duty cycle and frequency using a pulsed DC power supply. The microstructure was analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM), and mechanical properties were evaluated by a microhardness test and adhesion test. The maximum deposition rate for CrN x compound films could be reached to nearly 90% compared with that for pure Cr coating due to the increase of ionization efficiency caused by a negative-pulsed DC bias. As N 2 flow rate is increased, the microstructure of CrN x films was changed from Cr+Cr 2N to CrN. Also, a phase transformation occurred between Cr 2N+CrN multi-phase and CrN mono-phase by control of a negative DC and/or pulsed DC bias voltage, duty cycle and frequency. Microhardness for CrN x films were measured to be up to 1600 kg/mm 2 and the maximum hardness value of 2250 kg/mm 2 was obtained for CrN x film deposited with a N 2 flow rate of 20 sccm at a negative DC bias of −100 V.
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