Abstract
A three dimensional numerical model for the cooling of an electronic component by using a flat heat pipe (vapor chamber) is presented. The heat pipe consists of two copper flat walls, two copper water wicks and a vapor region sandwiched between the heat pipe wicks. In this paper, a three dimensional hydrodynamic model of the wicks and vapor regions coupled with a three dimensional thermal model of the heat pipe is presented. The hydrodynamic model of the wick and vapor region is obtained by solving numerically the mass, momentum and liquid vapor interface conditions in a three dimensional form. The temperature of the model is obtained by coupling the energy equation in a three dimensional form with the hydrodynamic model. The model are solved numerically by using finite difference method. The results illustrate well the function of the heat pipe and the circulation of the working fluid inside the wick regions. They also shows that ,for power input 107 W, the maximum liquid velocity is about 4.35×10 m/s
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