Abstract
A vapour-liquid-solid three-phase model is constructed to simulate liquid interface characteristics and condensation process near a solid wall by Molecular Dynamics (MD) simulation method. The three-phase model shows laminated liquid density distribution and oscillating distribution of tangential stress in the near-wall region. The density and temperature changing with time in the condensation process of superheated vapour argon on difform platinum surfaces are investigated. It is found that heat transfer enhancement of roughened surfaces is no longer obvious after the formation of a stable liquid film on them.
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