A study on recovery of SiC from silicon wafer cutting slurry

Abstract

The objective of this study is to recover SiC from silicon wafer cutting slurry using physical separation and acid/alkali purification processes. Hydrocyclone was used in the first-stage process to recover SiC and Si from silicon wafer cutting slurry. Through hydrocyclone separation, the SiC content and recovery of can reach 98 and 88%, respectively. In acid and alkali purification processes, the iron and silicon can be removed and further increase the SiC content up to 99.5%. From the test results obtained in this study, it is believed that the recycling and reutilization of SiC from silicon wafer cutting slurry can be highly feasible and economical.