Abstract
The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.
Highlights
Due to the tremendous growth in the IT sector, the demand for high frequency microstripline components have increased
Simple microstriplines of different widths are needed for a variety applications and to the authors knowledge the high frequency i.e., beyond 12.0GHz, characterization of the microstriplines have not been studied by many workers
Our results indicate that in the 8-18 GHz frequency range, both the thin film and thick film microstripline circuit behave almost in a similar way indicating that the specific problems inherent with thick film technology will not be a major problem in this region of microwave frequencies
Summary
Due to the tremendous growth in the IT sector, the demand for high frequency microstripline components have increased. There is a dearth of materials useful for such purposes. PURI indigenous fabrication of microstripline components which can be used for high microwave frequencies upto 18.0GHz. Simple microstriplines of different widths are needed for a variety applications and to the authors knowledge the high frequency i.e., beyond 12.0GHz, characterization of the microstriplines have not been studied by many workers. Thin film [1, 2] was the only process used for metallization for microwave purposes. Some recent studies by us [3,4,5,6] and others [7,8,9] have shown that thick films can be used as conductor part of the circuits
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