Abstract
Gauge Repeatability and Reproducibility (Gauge R&R , G.R.R) is of great importance for checking measurement system precision, traditional average-range G.R.R test involves equipment variation (EV) and appraiser variation (AV), which is not appropriate for current modern automatic measurement tools. In this paper, we designed different test experiments on film thickness (THK) and critical dimension (CD) metrology and statistically analyzed different variances impact on G.R.R. From THK G.R.R experiment ANOVA analysis, it can be seen that time interval and measurement process have no significant effect on G.R.R result, and the equipment repeatability variation is the major variation source. From CD G.R.R experiment ANOVA analysis, it can be checked that, G.R.R has significant time dependence of data collection due to test wafer changed. As a conclusion, not only appraiser’s variation but also time interval has less impact on metrology G.R.R of semiconductor wafer manufacturing process.
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