Abstract
This study presents a novel method for the synthesis of self-assembled cationic surfactants covering gold nanoparticle thin films and determines the underpotential deposition behavior of copper on such films. Based upon the solid–liquid interface penetration of copper ions through a self-assembled molecular layer, the variations in oxidation–reduction potential and the amount of copper ion desorption are determined, using cyclic voltammetry and linear sweep voltammetry analysis. The influence of various capping agents, cetyltrimethylammonium fluoride (CTAF), cetyltrimethylammonium chloride (CTAC), and cetyltrimethylammonium bromide (CTAB), on gold substrates is also determined. The blocking capabilities of surfactants that hinder ion penetration from the solution to the Au surface, through bilayers, are in the order: CTAB ≥ CTAC > CTAF.
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