Abstract
An observation on the relationship between stick-slip phenomena and chatter scratch generation during chemical-mechanical polishing (CMP) was made using finite element analysis. The motivation for this work is based on the questions about the possibility of the stick-slip phenomena in the CMP process and the quantitative relation between the stick-slip behaviors and the formation characteristics of the scratch. The finite element simulation results showed that stick-slip friction could occur during CMP and it could be seen only in the case of the interactions with the particles trapped inside pad surface. Also, the stick-slip period increased with the density of interacting wafer surface material and the particle size had a significant effect on the stick-slip period and magnitude. It is expected that this work will aid the development of chatter scratch reduction technology.
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