A Study of the Properties of PMR Polyimide Resin/Copper Foil Composites

Abstract

A PMR (polymerization of monomer reactants) polyimide resin was prepared from three monomer reactants: 5-norbornene-2,3'-dicarboxylic anhydride (NA),3,4'-oxydianiline(3,4'-ODA), and 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA). The polyimide resin and the copper foil were used to fabricate composites. Composite properties were tested for heat resistance and chemical resistance, and the dielectric constant and dissipation factor were also examined. After 24 h at 300oC the composites still had 73% retention of peel strength, the 1 MHz dielectric constant was 3.5, and the dissipation factor was 0.0160. After a hot/wet treatment (water at 50oC) for 72 h, the dielectric constant increased by 0.3%, while the dissipation factor increased by 33.9% from 0.0056 to 0.0075. After exposure to steam for 72 h, the polyimide laminates maintained 85% of their peel strength. A PEI resin laminate had a peel strength of only 872.2 N/m, but after a zirco-aluminate coupling agent surface treatment, a peel strength of 1519 N/m was obtained. The dielectric constant of the PEI resin was the lowest value (3.3678), and the dissipation factor was 0.0024. Commercialized epoxy resin laminate had a peel strength of 2450 N/m. At room temperature, the dielectric constant was 3.4793, and the dissipation factor was 0.0199.