Abstract

In order to obtain competitiveness in the field of industrial manufacturing, a reduction in the development period for the small batch manufacturing of products is required. However, metal forming tools cause multiple cracking on sheet metal strips during piercing process due to clearance between punch and die. Such a cracking eventually causes severe degradation of the critical current density. Therefore, it is very important to understand the microscopic deformation behavior of CuSn9 alloy under mechanical loading. A method of evaluating the strain over the deformed surface of stamping is described. Measurements of the deformation width of the edges of arbitrary holes on the sheet metal were analyzed to determine the strain and the stress distributions which were displayed in the form of contours. For an arbitrary hole piercing process, FEM simulation with ANSYS/LS-DYNA Test of Edbound with Eroding Contact was used and as the first step, strip process layout was designed. After that, the process of die development was studied according to the sequence of die components, i.e., die structure, machining condition for die making, die materials, heat treatment of partially die components, and so on. In this study, modeling of strip layout and die components with the Mechanical Desktop commercial program, standard components selection and strip process layout drawing with the Auto-LISP, CAD/CAM application, ordinary machine tool operating, and measurement microscopic cracking deformation is done.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.