Abstract
This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.
Highlights
Ceramic materials are increasingly used in technical practice, especially in the field of electrotechnology
These solders contain an active element which reacts with the surface of the ceramic material
The results of our experiments have verified the possibility of creating a soldering joint between a metal and an ITO ceramic
Summary
Ceramic materials are increasingly used in technical practice, especially in the field of electrotechnology. Soldering with the use of active solders is a current trend in this area. These solders contain an active element which reacts with the surface of the ceramic material. This enables it to be wetted and a reaction layer created. The solders have a very low wetting angle, enabling soldering at low temperatures, without flux and additional protection. At the interface of the soldered joint, a reaction layer several μm in thickness is created, which contains the reaction products of the active elements and the substrate [1]. The solder is activated mechanically or with the use of a very high temperature to influence the active element. The working cycle of the mechanical application is approximately 10 times shorter than high temperature activation, and does not require the application of a vacuum or a protective atmosphere
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