Abstract
Element Cu have been deposited on ceramic substrate by use of physical vapor deposition with plasma aided (Ion plating technology ) . The effect of deposition process parameter on mechanical properties of copper thin films were studied ( adhesion and microhardness ) . Also effect of surface nature and temperature annealing have been studied which obtained increase in adhesion and microhardness with increase in applied voltage and annealing . SEM study show that the smooth surface have good uniformity and interface type between the film and substrate .
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