Abstract
In the on-going drive for miniaturization, the overall design objective in electronics manufacturing is to achieve the best compromise between product performance, production cost (including rework), size, weight, quality and reliability. This has posed a major challenge to surface mount printed circuit board assembly processes. This paper focuses on the control of component solderability by the wettability of the lead’s geometrical design and its thermal demand with respect to flux kinetics, i.e. the movement of the contact line,1 in order to reduce the number of open joints created during the manufacturing process.
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