Abstract

Based on PVDF (piezoelectric sensing techniques), this paper attempts to study the propagation law of shock waves in brittle materials during the process of three-wavelength laser irradiation of polysilicon, and discusses the formation mechanism of thermal shock failure. The experimental results show that the vapor pressure effect and the plasma pressure effect in the process of pulsed laser irradiation lead to the splashing of high temperature and high density melt. With the decrease of the laser wavelength, the laser breakdown threshold decreases and the shock wave is weakened. Because of the pressure effect of the laser shock, the brittle fracture zone is at the edge of the irradiated area. The surface tension gradient and surface shear wave caused by the surface wave are the result of coherent coupling between optical and thermodynamics. The average propagation velocity of laser shock wave in polysilicon is 8.47 × 103 m/s, and the experiment has reached the conclusion that the laser shock wave pressure peak exponentially distributes attenuation in the polysilicon.

Highlights

  • A PVDF piezoelectric sensor, which has been developed in recent years with a high response frequency and above a 20 GPa pressure measurement range, is an ideal test component of laser shock waves [1]

  • The results show that the efficiency of polysilicon solar cells and microchannels is increased by 0.23%–1.50%

  • The vapor formed on the surface of the material forms a substance vapor with the outward splashing substance and continues continues to to absorb absorb the the energy, it is partially ionized to form a high temperature and high pressure plasma

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Summary

Introduction

A PVDF (piezoelectric sensing techniques) piezoelectric sensor, which has been developed in recent years with a high response frequency (nano_second level) and above a 20 GPa pressure measurement range, is an ideal test component of laser shock waves [1]. Because the band width of silicon materials is narrower than other materials (1.12 eV at 300 K), they have a large intrinsic absorption of the infrared band laser. They are brittle materials with a narrow plastic region, so they are prone to be damaged in the infrared wavelength of strong light irradiation [3]. Chen et al [4] used a laser to etch microchannels on the surface of polysilicon to increase photoelectric conversion efficiency of polysilicon solar cells. The results show that an abnormally high etching depth is observed on the silicon surface when the intensity of the incident laser exceeds a Materials 2017, 10, 260; doi:10.3390/ma10030260 www.mdpi.com/journal/materials. Theoretical Analysis of Thermodynamic Effects of Polycrystalline Silicon Irradiated by Single

Analysis of Vapor Pressure Effect
Plasma Shock Wave Pressure Effect
Experimental Equipment and Methods
Vapor Pressure Effect on the Target
The melting and
Effect of Plasma Shock Wave Pressure upon the Surface of the Target
Cleavage
Dynamic Strain of Laser Irradiation Light Spot of Target Edges
The Attenuation Rule of Laser Shock Wave in Polysilicon
Conclusions
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