Abstract
It was recently shown(1)that gaseous and organic inclusions in electrodeposits can he detected "by transmission electron microscopy (TEM) using a through-focus imaging technique. In this study, we have investigated the sites for incorporation of inclusions and their spacial distribution in copper electrodeposit by TEM.A copper film was electrodeposited on an annealed OFHC copper sheet in a sulfate electrolyte (200 g/l CuSo4-5H2O, 50 g/l H2So4) containing 5 M Mol./l O-phenanthroline as an organic additive. Plating was carried out at room temperature and at a current density of 5 MA/cm2.In order to detect gaseous and organic inclusions, all copper deposits were examined in overfocussed as well as underfocussed conditions. In each case, stereo-pairs(2)were obtained. Figures 1 and 2 show stereo-pairs of the deposited copper film taken in overfocussed and underfocussed conditions, respectively.
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