Abstract
The change of internal friction peak of grain boundaries (Kê peak) in copper has been studied in the course of creep. It can be deduced that the strength of grain boundaries is little changed during creep at high temperature and low stress; somewhat increased at medium temperature and medium stress; and greatly increased at low temperature and high stress. The extent of strengthening of grain boundaries is different under different creep conditions, which is believed to play an important role in leading the different type of creep rupture. This provides a modification and complement of the idea of “equicohesive temperature”.
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