Abstract
The effect of an accelerator on the morphological evolution during copper electrodeposition was investigated with the designed one-directional (1-D) pattern which has a seed layer only at the bottom of the pattern. Field-emission scanning electron microscope images showed that there was no superfilling found in the pattern with 0.2 μm width trench and no reduction in the surface area during electroplating. This indicates that superfilling in a damascene pattern results from the accumulation of the accelerator. It was found that copper damascene electroplating for ultralarge-scale integration is a simple electroplating system that is controlled by the activation overpotential of adhered organic additives, not by the concentration overpotential of copper ions.
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