Abstract
Matched circuit components are widely used in logic circuits including resistors, capacitors and transistors. Any variations in those components could cause mismatch in circuit performance. In advanced technology nodes, double patterning (litho/etch/litho/etch) process has been introduced to pattern BEOL metal and via levels. Two patterning steps (litho/etch/litho/etch) with two sets of masks for litho printing and with two independent etch processes, could result in pattern dimension difference which leads to resistance and capacitance (RC) mismatch. In wire or via heavily dominated logic circuits, this RC mismatch may be sensitive to design-matched circuit components.
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