Abstract
A new cleaning agent for silicon contamination in the wafer dicing process was formulated in this research. Ammonium bifluoride was introduced as the main ingredient in the formula, and MSA and sulfuric acid were added as the solvent and buffer solution against metal corrosion. It was confirmed that the new formula cleaning agent could be used in the cleaning of silicon contamination from dicing. Silicon contamination is common in the wafer dicing process and consists of silicon powder and relevant metal particles during cutting, all of which are mixed with some adhesive residues. These contaminating particles on the IC surface are exposed to cleaning agents. However, while it is imperative to clean the wafer, the exposed surface is also vulnerable to damage from the solution. This further complicates the procedure because there is currently no ideal cleaning agent for the process. Our proposed formula hopefully provides an ideal chemical for use in wafer cleaning (SC-1, SC-2, BOE), since it uses a less toxic compound, ammonium bifluoride, which yielded good results during our experiments.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
