Abstract

Injection-moulded adhesive joints of aliphatic polyamides and metals were studied and showed that intermediate thin adhesive films applied from polymer or oligomer solutions onto metals is an efficient means of monitoring the bond strength. Contact events in a metal/thin polymeric film/polyamide system have been investigated and the results are described here. The thickness of intermediate films whose optimum values range from a few tenths to 1–2 μm were found to be a most important parameter that determines the adhesive strength. The bond strength improvement is most obvious during a thermal contact between the intermediate film and metal in air. Adhesive bonds are formed between the metal and the film which are resistant to dynamic stresses and liquids. The bond between polyamide and the intermediate film is usually formed owing to molecular interactions of polar groups in macromolecules at the interface. The joints were found to fail cohesively through the intermediate film. The improved adhesion to metals and cohesive strength of thin intermediate films are believed to result from the fact that thermo-oxidative degradation is inhibited in these during the thermal contact with metal.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.