A stabilized state-based peridynamic heat conduction model for interface thermal resistance problems

Abstract

As the demand for micro/nano-scale electronic devices and composite materials grows, numerical modeling of interfacial thermal resistance problems has become an integral part of the design for these devices and materials. In this work, a stabilized state-based peridynamic heat conduction model considering the Kapitza thermal resistance is proposed. A stabilized scheme is first developed to eliminate the numerical oscillations in the state-based peridynamics. The main idea is to formulate the temperature gradient for each individual bond by penalty function. The corresponding heat flow state is then constructed based on this newly developed bond-augmented temperature gradient in the framework of the Lagrangian formalism. The stabilization scheme is combined with the embedded discontinuous peridynamic concept to capture the temperature jump conditions of interface thermal resistance. The effectiveness of the proposed model is demonstrated by numerical examples. It paves the way for investigating the interfacial thermal resistance problems of materials with complex heat transfer constitutive relations.