Abstract
During room-temperature aging, a morphological transition described as a spontaneous morphology change was discovered to occur on the surface of single-crystal copper electrodeposits grown epitaxially on {001} copper substrates. Within half to two hours after the completion of deposition, well-defined periodic contour lines appeared suddenly around the originally smooth-faced pyramids. These contour lines were thought to represent periodic cracks/steps, which were formed to relieve tensile stress developed as a result of surface annihilations of excess vacancies trapped in the deposits. Thus the formation of these lines was phenomenologically the same as the sudden appearance of fine grains observed previously on the surface of polycrystalline copper electrodeposits during room-temperature aging.
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