Abstract

The procedure for creation of the SPICE compatible spatial equivalent circuit model of the heatsink is presented in this paper. The model is based on the electro-thermal analogy and finite volume partitioning approach. It is validated by comparing the simulation results with the experimentally obtained data and the finite-element-modeling simulations. Simulations of complex, coupled thermo-electrical systems in electrical circuit simulators are enabled using the model.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call