Year-end Sale % OFF 
Abstract
Demonstrated and investigated here is a method to seal microfluidic systems by soldering. As a particularly difficult case of growing importance, the sealing of openings contaminated with paraffin wax was studied. Solder paste, screen printed on a metallized silicon substrate, was melted locally through application of 6.5–10 V to a 5 Ω copper film resistor for a few seconds and was found able to drive an intermediate layer of paraffin away and seal a 0.2 mm diameter circular via by wetting a surrounding copper pad. Although verified to be robust, the process did result in failing seals on excessive heating because of consumption of the pads. Correctly performed, the technique provided a seal at least withstanding a pressure of 8 bar for 8 h at 85 °C.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
