A single-vision dual imaging optical system in flip chip alignment

Abstract

In the case of flip-chip, the key to high-quality packaging is the high-precision alignment of the chip to the PCB. High-precision alignment is usually achieved using vision. Since the lens and camera are expensive and the camera coordinates system conversion is cumbersome, the single-vision system is proposed. However, there are defects in that the loss of light source is large, and the coaxial optical lens cannot be used. In this paper, a new single-vision dual-imaging optical system is proposed based on Zemax, which effectively solves the defects of the old single-vision system. The results show that the system can reduce the use of the lens and camera, reduce the use cost of the equipment, and easily convert the camera coordinate system to ensure the imaging quality.