Abstract
This paper presents a mathematical model for the simulation of evaporating meniscus-driven dielectric coolant flow in a channel between two parallel flat plates, one of which is heated and simulates the I.C. chip surface to be cooled, and the other is assumed to be insulated for convenience of modelling. The model comprises of the energy and momentum equations which incorporate the Young-Laplace equation for the driving force. The coolant rise length, velocity and capillary number are obtained for various coolants at different heat fluxes and channel inclinations. The data generated give the domain of feasibility of the concept and may be useful in the thermal design of electronics cooling.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
