A simple optical system to optimize a high depth to width aspect ratio applied to a positive photoresist lithography process

Abstract

The fabrication of micro electro mechanical systems by electrodeposition inside resist moulds has provided much interest in recent years. In this paper, we propose a method to optimize the lithography process of a thick positive photoresist. This technique is based on the variation of transparency of the photoresist during exposure. During exposure the absorption of the light-sensitive compound decreases due to its conversion into indene carboxylic acid. A very good aspect ratio (height:width) of up to 10:1 and high edge steepness has been obtained from one coat and one UV exposure.