Abstract
A silicon micromachined gyroscope (angular rate sensor, yaw rate sensor) and accelerometer for vehicle stability control system is presented. The 5.1mmX4.7mm sensor chip is fabricated with a silicon micromachining process using a SOI (Silicon on Insulator) silicon wafer and a deep reactive ion etching. The sensor chip has a pair of resonators which are mechanically coupled and function as a tuning fork. The resonators are driven by electrostatic force and their movements are detected by capacitively sensing angstrom displacements. This sensor chip works not only as a gyroscope but also as an accelerometer with a single senior chip. The sensor unit consists of the sensor chip above, a signal processing IC, a microcomputer and an EEPROM. sigma-delta analog-to-digital conversion (sigma-delta ADC) is adopted to realize the digital calibration of sensor properties. Sigma-delta modulators on the signal processing IC convert the analog signals of angular rate, acceleration and temperature into oversampled 1-bit digital data. These data are transmitted to the microcomputer and converted into high-resolution, multi-bit digital data through the process of digital decimation filter. Sensor variation is calibrated by the microcomputer with the calibration data which has been stored in the EEPROM.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.