Abstract
Abstract This paper describes the development of a silicon-based force sensor packaged in a flexible polyimide-based package. The fabrication process is compatible with standard integrated circuit processes and produces a flexible package that sandwiches the metal leads between protective polyimide layers. Silicon direct bonding and bulk micromachining (both isotropic and anisotropic) are utilized to fabricate the silicon sensing element. The sensing element consists of a circular diaphragm (200 μm thick with a 200 μm radius) over a 10 μm deep sealed cavity. The shallow capacity depth provides built-in overforce protection. The diaphragm is instrumented with piezoresistors in a Wheatstone bridge configuration. Sensitivity to force is realized via the addition of a solid dome over the silicon diaphragm. The dome transmits the applied force to the diaphragm. Torlon and epoxy domes are bench tested. The epoxy dome produces significant hysteresis, while the Torlon dome shows low hysteresis (2.4% of the mean output) and low nonrepeatability ( −1 N −1 are typical. The response is linear for low forces (
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
