Abstract
Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal conditions was formulated through experimental testing and theoretical modeling. The shear strength degradation data were obtained from different hygrothermal aging tests and the ACA moisture properties were characterized for the corresponding hygrothermal conditions. Theoretical models considering the hygrothermal factors of T (temperature), RH (relative humidity), and t (time), were used to fit the shear strength degradation data. It was found that the inverse exponential law was the best candidate model to predict the degradation data. The shear strength degradation model of ACA joints under hygrothermal conditions was proposed, where the relationship of the S (shear strength) and the hygrothermal factors (T, RH, and t) was expressed in an analytical model. The degradation model was validated by experiments, and the model predictions agreed well with the test results.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
