A shaft-loaded blister test for elastic response and delamination behavior of thin film–substrate system

Abstract

The elastic response of a thin film of photoresist deposited on a silicon wafer is studied by using a shaft-loaded blister test method developed recently. Experiment data are compared with an analytical solution. Results demonstrated that under shaft loading, the thin film underwent a pure bending mode at small deformation and gradually transformed to a pure stretching mode at larger deformation. The effect of residual stress on elastic response is also studied. The delamination of thin film from substrate can be successfully measured under displacement control mode by the shaft-loaded blister test.