Abstract
Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 /spl mu/m thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165/spl deg/C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250/spl deg/C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits.
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