A Review on Peltier Device and Heat Dissipation of It’s Hot Surface Using Fins

Abstract

Abstract: The branch of thermal science is widely involved in refrigeration theory used at many places like Air Conditioners, Air Cooler, Refrigerator, etc. Refrigeration cycles and their concept were newly introduced in early 1834 and after that in 1913 refrigerators for possible to use for home applications and at various places. When it comes to cooling mainly the refrigeration process comes in mind for the solution, But Peltier effect which is reverse of seebeck effect is also well known for cooling as portable cooling in compact size is possible by TEC Module as Peltier devices generates heating at one side and cooling at other side when there is a voltage difference between two dissimilar metals. TEC Module of various ampere gives various ranges of temperature at different voltages and current. Different models of TEC Module (Peltier device) are mainly varied in terms of current as no. of P-N junctions remains same as voltage and current can be modified. The heat generated in at one side of Peltier device is extremely high and if that heat is not dissipating then TEC module will be damaged and won’t be possible to bring back in working conditions. So, in Heat Transfer the theory of extended surface is mainly important for heat dissipation. So different geometry of fins is being used such as rectangular fins, Annular fins, Trapezoidal fins, Inversely Trapezoidal fins, etc. The shape and thickness of fins are the most important factors affects heat dissipation. Another thing needed to be taken in account is analysis on material composition of fins which is affected by the term thermal conductivity of the materials. Keywords: Peltier Device, Thermoelectric Module, Heat Dissipation, Fins, Peltier Effect, Refrigeration, Heating, Portable cooling, and heating.