Abstract
AbstractElectrofusion joining is now an essential and widely used method to assist in the creation of polyethylene pressure pipe systems. The process of electrofusion joining is reviewed by examining the experimental and some computer simulation literature relating to the temperature and melt pressure changes during the fusion process, and on how varying fusion time and pipe/fitting gap influences the strength of electrofusion joints. From this literature review, four key stages in the joining process are identified. First, an incubation period where the joint has no strength. Second, a joint formation and consolidation stage where an increasing joint temperature aids molecular diffusion to both increase the joint strength and promote a more ductile mode of failure. A plateau region then follows where the joint strength, and ductility, remain reasonably constant despite the fusion time increasing. This plateau is thought to allow some welding variables, such as gap, to have only a small influence on joint strength (for gap maintained within reasonable limits). Finally there is a cooling stage where the joint bridging “tie molecules” become locked into either side of the joint. It is these tie molecules that give the joint its ductility and strength. The concluding section of the review notes some of the important on‐site practices that, if followed, allow electrofusion joints to acquire their good strength properties, and hence give polyethylene pressure pipe systems of a high integrity.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.