Abstract
Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.
Highlights
The influence of temperature, which ranges from 200–350 °C, on the shear strength of the joints bonded with Pb95Sn5 solder and Ag NP paste are shown in Figure 6a.10The of 14 strength of the joints using Ag NP paste rises after heat treatment at 250, 300, and 350 °C, which can be attributed to the further sintering
This review summarized our research progress on the sintering–bonding technology using Ag NPs for electronic packaging applications
The reduction of organic components in the paste was helpful for achieving low-temperature bonding
Summary
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. It has been reported that adding organic components to Ag NPs can prevent self-aggregation in the traditional synthesis process [22,23,24,25,26] This has a negative effect on sintering because the added organic components remain in the bonding layer [27]. They prevent surface and lattice diffusions from the surface and grain boundary of NPs during the sintering process, leading to a low strength bonding. Nanomaterials 2021, 11, 927 surface and lattice diffusions from the surface and grain boundary of NPs during the sin of 14 tering process, leading to a low strength bonding. We summarize lenges that should addressed for future research. our findings and the challenges that should be addressed for future research
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