Abstract
Since its introduction in 1995, nanoimprint lithography has been demonstrated in many researches as a simple, low-cost, and high-throughput process for replicating micro- and nanoscale patterns. Due to its advantages, the nanoimprint lithography method has been rapidly developed over the years as a promising alternative to conventional nanolithography processes to fulfill the demands generated from the recent developments in the semiconductor and flexible electronics industries, which results in variations of the process. Roll-to-roll (R2R) nanoimprint lithography (NIL) is the most demanded technique due to its high-throughput fulfilling industrial-scale application. In the present work, a general literature review on the various types of nanoimprint lithography processes especially R2R NIL and the methods commonly adapted to fabricate imprint molds are presented to provide a clear view and understanding on the nanoimprint lithography technique as well as its recent developments.PACS81.16.Nd
Highlights
Recent developments in semiconductor and flexible electronics applications have observed a rapid increase in demands for lower cost, higher throughput, and higher resolution micro/nanofabrication techniques
Since its introduction back in 1995, the rapid development of the nanoimprint lithography process has resulted in a number of variants in the process, which can be categorized based on its two main operation features: resist curing and type of imprint contact
As for the types of imprint contact, the process can be categorized into three common types: plate-to-plate (P2P) nanoimprint lithography (NIL), roll-toplate (R2P) NIL, and roll-to-roll (R2R) NIL
Summary
Recent developments in semiconductor and flexible electronics applications have observed a rapid increase in demands for lower cost, higher throughput, and higher resolution micro/nanofabrication techniques. For thermal R2R NIL, the process may be conducted without the need for continuous resist coating mechanism, where the patterns are imprinted directly onto a heated polymer substrate as shown in Figure 13 [45], similar to their R2P counterpart by Song et al [36] and Lim et al [37]. Using this method, the process is further simplified as the need for control of resist coating uniformity is not required. A similar uniformity is needed to achieve imprint rollers in order to prevent transmission of low-frequency and long-range surface waviness onto the replicated pattern
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
