Abstract
Abstract The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and Huawei Mate X (2019), require increased battery size and processor performance to drive their larger flexible displays. There is a growing need to develop flexible thermal management solutions to cool these foldable electronic devices. This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology. This review discusses various types of heat pipes, their thermal performance, novel manufacturing processes, and the open research questions, challenges, together with the potential future directions of this research area.
Highlights
Thermal management of mobile electronic devices is governed by user comfort, limiting operating performance [1,2]
Natural convection cooling is a passive cooling strategy that is primarily dependent on the mobile device surface area and the tem perature difference between the outer casing and surrounding ambient conditions [6], the latter of which is predominantly fixed by user comfort
The results showed that the heat pipe could effectively dissipate 160 W at a thermal resistance of 0.16 K/W in the horizontal orientation
Summary
Thermal management of mobile electronic devices is governed by user comfort, limiting operating performance [1,2]. Except the Lenovo X1 fold, uti lizes the same processors class as their non-flexible counterparts These processors have a thermal design power (TDP) of 5–6 W and use natural convection cooling from the phone chassis to dissipate the generated fluxes. As noted from their thermal management systems, only the Huawei Mate Xs implements a solution to transfer heat from the high heat-generating components on the motherboard across the articulating joint This means ~50% of the listed phones’ surface area is not utilized in cooling the devices. Microsoft [47,48] filed patents that discussed a flexible thermal conduit that connects two sections of an electronic device similar in design to a vir tual reality headset, transferring heat from a source to a heat-dissipating structure. This article will guide the development of flexible ultra-thin vapour chambers for the generation of foldable mobile electronic devices
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
