Abstract
Passive integration technology is widely used in power electric converters since it can significantly reduce the volume of the passive components and improve the power density. This article highlights the flexible multilayer foil (FMLF) integration technology since it can meet the future requirements than other integration technologies. The realization, structures, and applications of the FMLF integration technology are summarized. The magnetic materials, dielectric materials, and conductive materials used in FMLF are investigated. Then, the approaches of the analysis and design for FMLF integrated units are introduced. Finally, it is compared with the planar printed circuit board integration technology to highlight the advantages of its characteristics and expounds its future research fields. Eventually, the power electronics engineers and researchers can comprehend the intrinsic properties of the FMLF integration technology.
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