Abstract
Transient liquid phase (TLP) bonding is a bonding technique that has attracted several applications in high-temperature electronics, in particular, power electronics packaging. The main advantage of TLP bonding in microelectronics manufacturing is that it can be processed at a low temperature while remaining stable at relatively higher temperature. However, void formation is reported to be one of the major drawbacks in this bonding technique due to deteriorating effects of voids on shear strength and long-term reliability of TLP bonded joints.This review helps future studies to distinguish the causes of void formation in various materials that are used in TLP bonding. It will also help select the suitable solution to prevent the formation of voids and consequently improve the reliability of the TLP joint.
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