Abstract
Owing to the localized heating and untouched advantages, the laser jet solder ball bonding (LJSBB) is particularly adapted to preparing for the three-dimensional (3D) solder joints and the temperature sensitive sensors. Subsequently, the failure and reliability of solder joints fabricated by LJSBB were extensively studied. However, the LJSBB process is very prompt and the size of solder joints is very small, some failures and defects formed in mass production are particularly different from other mass soldering processes, and the corresponding prevention measures or the resolution methods are more difficult researched and provided. Based on the previous studies, the reasons of some typical and tough defects of solder joints formed in LJSBB process, such as the poor wetting, the bridging, the crack and the tin spattering, are reviewed and discussed in this review, and the corresponding purpose is to provide some clearly resolution or schemes for LJSBB mass production.
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