Abstract
It is useful to be able to further miniaturize printed wiring boards (PWBs) to achieve more compact and multi-functional mobile electronics. Since about 40–50% of the surface of a PWB is covered with passive elements such as capacitors, it is clear that miniaturization would improve performance. On the other hand, PWBs have a low temperature resistance, and thus the boards cannot use capacitors that require higher processing temperatures. The nano-transfer method, which consists of release and transfer steps, solves this problem. After the capacitor is fabricated on a high-temperature-resistant substrate, it is released from the substrate and mounted on the PWB. The purpose of this study is to clarify the release process in order to establish a fabrication technology for embedded substrates.
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