Abstract
To meet the dual requirement of high flow rate and high output pressure in water-cooling system of electronic chip, a quintuple-bimorph tenfold-chamber piezoelectric pump (QTPP) is presented, which owns the comprehensive advantages of parallel and serial connection. QTPP is composed of two groups of five-chamber-in-series, and the two groups of five-chamber-in-series can be in parallel or serial. QTPP is designed and fabricated, the output performance of which is invested by experiments. The experimental results show that QTPP can obtain high flow rate and high output pressure under low driving voltage. When driven by quintuple piezoelectric vibrators under 60Vpp, QTPP in parallel can obtain the maximum flow rate of 251.1ml/min and the maximum output pressure of 60.2kPa. While in serial, QTPP can obtain 186.2ml/min and 109.9kPa respectively. The water-cooling system with QTPP is established and experimented. The experimental results indicate that the water-cooling system with QTPP can achieve a good cooling performance under low driving voltage. Under the driving voltage of 60Vpp, QTPP can reduce the temperature of stimulate chip from 107.8°C to 51°C.
Highlights
In recent decades, with the development of fabrication and processing technology, especially the rapid expansion of MEMS and IT, the integration level of various chips has improved by a large margin [1], [2]
A quintuple-bimorph tenfold-chamber piezo electric pump (QTPP) used in water-cooling system of electronic chip is presented in this article
A quintuple-bimorph tenfold-chamber piezoelectric pump (QTPP) used in water-cooling system of electronic chip is presented in this article
Summary
With the development of fabrication and processing technology, especially the rapid expansion of MEMS and IT, the integration level of various chips has improved by a large margin [1], [2]. The high integrated electronic chips have a common question of heat accumulation, which makes Moore’s law face a considerable challenge. Promoting the heat dissipation efficiency has become the priority in the field of high integrated electronic devices [3], [4]. On account of high heat dissipation efficiency of the electronic chip, water-cooling system has been widely applied [5]. With the advantages of compact size, no electromagnetic interference and low power consumption, piezoelectric pumps own a wide application prospect to be used in water-cooling system of electronic chip [7]–[10]. Tang et al [11] presented an integrated heat sink with a piezoelectric micropump (IHS-PMP). Davis et al [12] demonstrated a water-cooling system driven by a piezoelectric pump based on double piezoelectric bimorphs.
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