Abstract

Quantitative study on the elastic and plastic thermomechanical coupling effect of solid materials has important theoretical significance for monitoring the deformation state and stability evaluation of engineering components. In this study, the sample is made of polymethyl methacrylate (PMMA), and uniaxial compression experiments are carried out. The sample experiences the elastic state and then the plastic state until the failure of the sample. The thermoelastic effect and thermoplastic effect in the deformation process of PMMA materials are monitored by infrared thermography and digital speckle system (DIC). That is, the relationship between the reversible elastic temperature change ΔTe and average stress change Δσm, and the relationship between the irreversible plastic temperature rise ΔTp and the dissipated energy ΔUp during the failure deformation process. The results show that when the sample is in the elastic regime, there is only elastic temperature change ΔTe inside the sample. When the sample enters the plastic deformation regime, the total temperature change ΔT includes elastic temperature change ΔTe and plastic temperature change ΔTp, and the temperature change has an obvious memory effect on the previous maximum load. When the previous maximum load exceeded, ΔTp increases rapidly. When the load P is removed, ΔTe disappears, and ΔTp remains. Combined with the theory of thermodynamics and solid mechanics, starting from the 3D stress state, the approximate linear incremental relationship between Te and σm, and the accurate exponential total quantity relationship are derived. The incremental relationship and the full relationship combined with thermodynamic theory and the energy conservation principle, the relationship between the overall plastic temperature rise ΔTp and local plastic temperature rise ΔTpmax of the sample and the energy dissipation value ΔUp experienced by the sample and the local dissipation specific energy Δup is obtained. The theoretical calculation results of ΔTe and ΔTp are in good agreement with the experimental results. The research results can provide a new method for monitoring and identifying the stress and deformation state of engineering components through the temperature field.

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