A Prediction of the Thermal Fatigue Life of Solder Joints Using Crack Propagation Rate and Equivalent Strain Range

Abstract

With high performance and high density of computer and other electronic circuits, it becomes very important to assure the reliability of smaller and smaller solder joints. In particular, more accurate prediction of thermal fatigue life is required for large thermal stress induced by power and temperature cycling. In this chapter an accurate estimation method for thermal fatigue life is described.