Abstract
AbstractThe use of plastic encapsulated devices (PEDs) for a variety of market sectors has been the subject of much discussion over the past two decades. The advantages of lower cost together with the inherent mechanical ruggedness of these non‐cavity packages have been weighed against the concerns over quality and reliability and, in particular, electrical operation at extremes of temperature. This paper presents the results of some practical work undertaken on a modern LSI device in a plastic leaded chip carrier package. It then discusses British Telecom's experience with PEDs to date and concludes with some general considerations on the quality assurance requirements a purchaser may place on vendors of such devices.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
