A practical approach to packaging magnetic bubble devices

Abstract

A practical approach to packaging magnetic bubble devices is described. The aim of this package concept was to devise and maintain a nonvolatile bubble register, of low cost, low power consumption, and capable of being repaired easily. The package design incorporates existing techniques, manufacturing processes, and tooling. The criteria of nonvolatility is achieved with the use of permanent magnets and permalloy keepers which encompass the device package, Low cost and low power consumption are possible with the use of epoxy glass laminates containing etched drive coil configurations and I/O terminations. The magnetic devices contained within these laminations are accessed via module I/O pins. The product package, as compiled, features low inductance drive coils, uniform magnetic fields, low I/O noise levels, and a low physical profile. Thermal problems as well as shock and vibration problems have been minimized by the inherent design.