A plane stress model of bond-based Cosserat peridynamics and the effects of material parameters on crack patterns

Abstract

A plane stress model of bond-based Cosserat peridynamics is proposed, of which the constitutive equations of Cosserat continuum are implemented. The rotation of the proposed bond-based Cosserat peridynamic model is independent with the translational displacement, and the couple stress is considered in the material points’ interaction. The proposed model can degenerate into bond-based peridynamics and micropolar peridynamics under certain conditions. Several examples of crack propagation are designed to investigate the effect of material parameters on crack patterns. The numerical results are compared with other peridynamic models and experimental results to validate the proposed model. The numerical results show that the Cosserat shear modulus and the tangential stiffness of bond have an impact on crack propagation, including crack branching and crack pattern.